Adaptive control of power supply for integrated circuits

ABSTRACT

The present invention relates to a circuit arrangement and method for controlling power supply in an integrated circuit wherein at least one working parameter of at least one electrically isolated circuit region ( 10 ) is monitored, and the conductivity of a variable resistor means is locally controlled so as to individually adjust power supply for each of said at least two electrically isolated circuit regions ( 10 ) based on the at least one monitored working parameter. Thereby, a fast and simple control functionality with low area overhead can be provided.

The present invention relates to a circuit arrangement and method forcontrolling power supply in an integrated circuit (IC). In particular,the invention relates to integrated circuits which are subdivided intoelectrically isolated islands, where parameters such as supply voltage,clock frequency etc. of each island can be controlled individually.

Power efficiency is becoming a major issue as circuit technology isscaling towards smaller feature sizes. For high-performanceapplications, a scaled technology provides higher operating frequenciesand a higher level of integration as long as the power limitations ofpackage and cooling parts are not exceeded. The requirements forportable applications are even more stringent, because battery lifedepends on the energy consumption. Despite advances in batterytechnology, the demand for low-cost and small form-factor devices haskept the available energy supply roughly constant by driving downbattery size. Low-power and low-voltage designs will be important forthe further progress in Ultra Large Scale Integration (ULSI) designs.

Lowering the power supply voltage provides significant power savings.However, it can be observed that circuit delay increases for decreasingpower supply voltages, which may lower the chips operating frequencyresulting in a degradation of the circuit performance. Thus, there is atrade-off between circuit performance and power reduction.

Basically, two ways of lowering the power supply voltage withoutcompromising system performance have been suggested. One commontechnique is to determine the optimal, e.g. lowest, power supply voltageduring the design phase of the IC. When this is done for a whole IC, thelower energy consumption will be at the cost of increasing gate delays,as indicated above, which leads to reduced system performance. If thisperformance reduction is not desired, the IC can be partitioned intodifferent functional regions of which each region is powered by its owndedicated supply voltage, so-called ‘islands-of-voltage’. Since theperformance requirements of non-critical regions of the IC are lowerthan those of the critical ones, their supply voltage can be lowered inorder to save power without deteriorating system performance. Theoptimal or lowest supply voltage of the non-critical regions isdetermined during the design phase, while the critical regions arepowered off the nominal supply voltage. The other technique is dynamicsupply scaling which can decrease the systems average energy consumptionduring operation without sacrificing the system performance. Bydynamically varying both the operating frequency and the power supplyvoltage in response to workload demands, a processing unit alwaysoperates at just the desired performance level while consuming theminimal amount of energy. During reduced workload periods, dynamicsupply scaling lowers the supply voltage to slow down computationinstead of working at a fixed high voltage and allowing the processingunit to idle. Both of the described techniques can also be combined incase the IC is partitioned into different functional regions.

In ‘Managing power and performance for system-on-chip designs usingVoltage Islands’, Lackey et al., Proc. of ICCAD 202, San Jose, USA,10-14 Nov. 2002, pages 195-202, a system architecture called “voltageislands” is proposed to reduce power consumption of System-on-Chip (SoC)designs. The voltage islands methodology allows designers toindependently optimize functional blocks of the SoC design to run attheir optimal supply voltage. Therefore, each functional block can havepower characteristics unique from the rest of the design. However,voltage islands require additional circuitry to handle differences inboth magnitude and timing that can occur between internal supplyvoltages (island voltages) and external supply voltages at islandboundaries. Voltage island receivers perform this function for signalsgoing from the parent block into the island, while voltage island drivercells perform the equivalent function from the island to the parentblock. These drivers and receivers must provide reliable voltage levelshifting for a wide range of operating voltages, and do so with minimumimpact on signal delay or duty cycle.

Furthermore, adaptive voltage supply has been proposed to be used fordifferent functional regions on a single chip. In this way, the supplyvoltage of those regions can be optimized individually, and therebyallowing further performance optimization. As an example, Nowka et al.describe in ‘A 32-bit PowerPC system-on-a-chip with support for dynamicvoltage scaling and dynamic frequency scaling’, IEEE Journal ofSolid-State Circuits, November 2002, Vol. 37, No. 11, pages 1441-1447 asystem-on-a-chip processor which makes use of dynamic voltage scalingand on-the-fly frequency scaling to adapt to the dynamically changingperformance demands. The SoC makes use of active power reductiontechniques to dynamically match the power consumption with therequirements of the application. Active power consumption is reducedwhen resources demands are low through the use of dynamic voltagescaling, dynamic frequency scaling, unit and register level functionalclock gating. To support dynamic voltage scaling in this SoC, the powerdistribution has been divided into four distinct power domains of whichtwo domains are voltage controlled.

Additionally, Miyazaki et al. describe an autonomous and decentralizesystem in ‘An autonomous decentralized low-power system withadaptive-universal control for a chip multi-processor’, IEEEInternational Solid State Circuits Conference, Digest of TechnicalPapers, San Francisco, USA, 8-13 Feb. 2003, pages 108-109, where eachprocessor can operate at a minimum power consumption while maintainingspecified performance. The power supply and clock are supplied to eachmodule by global-routing lines, and each module is equipped which avoltage regulator and clock divider. A self-instructed look-up table ineach module determines the voltages and frequency applied to therespective module. A compound built-in self test unit measures theperformance of each module during the initial chip-testing phase andsends the data to each look-up table for memorization and use.

However, the above decentralized systems require sophisticatedadaptation and power conversion circuits which increase area overheadand processing requirements.

It is therefore an object of the present invention to provide a simpleadaptive control scheme with low area overhead for independent controlof power supply to electrically isolated islands of an integratedcircuit.

This object is achieved by a circuit arrangement as claimed in claim 1and by a control method as claimed in claim 21.

Accordingly, a very simple autonomous scheme for power control isprovided where the controlled supply voltage can be varied in a widerange as a function of different parameters like workload, requiredcircuit performance of the electrically isolated circuit regions or thelike. The use of variable resistor means for adjusting the individualpower supply provides the advantage of low area overhead compared to theknown solutions which require DC-DC converters and other dedicatedcircuits, and enables simple digital control and fast transientresponse. Furthermore, no additional external components are required asin the case of DC-DC converters. Basically, the suggested control systemsenses the island's activity and operational conditions andcorrespondingly adapts the variable resistor means to compensate for theresistance variation of the island, i.e., isolated circuit region.

The variable resistor means may comprise transistor means connected inseries between the isolated circuit regions and at least one powersupply terminal. The transistor means add additional resistance betweenthe isolated circuit regions and their supply lines, while the powersupply voltage can be controlled by changing the series resistance valueintroduced by the transistor means. Thereby, no changes are required inthe global power network of the whole integrated circuit. In particular,the transistor means may comprise a first transistor connected between afirst power supply input of a dedicated one of the isolated circuitregions and a first one of the power supply terminals, and a secondtransistor connected between a second power supply input of thededicated one of the isolated circuit regions and a second one of thepower supply terminals, wherein the local control means may be arrangedto supply a first control signal to the first transistor and a secondcontrol signal to the second transistor, and wherein the first controlsignal may be an inversion of the second control signal. Each of theisolated circuit regions can thus be put into a standby mode when bothfirst and second transistors are switched off to thereby reduce thecircuit's power consumption to a minimum value.

The transistor means may be divided into a plurality of transistorsegments each segment or subset of segments being connected to a bit ofa dedicated control register which is set by the local control means. Adiscrete digital control of the resistance value can thus be introduced,wherein the control register can be easily programmed or reprogrammed atruntime to enable adaptive supply voltage control.

The local control means may comprise a first control function forcompensating average voltage fluctuations, and a second control functionfor compensating voltage fluctuations due to activity changes of adedicated one of the at least two electrically isolated circuit regions.Thereby, a slow control function can be provided for compensatingenvironmental or chip-specific variations, while a fast control functioncan be provided for compensating variations in the processing load. Thefirst control function may be used for controlling a clock frequency ofthe dedicated one of the at least two electrically isolated circuitregions. Thus, the first control function can be used to correct thepower supply voltage for a desired clock frequency.

The first and second control functions may be adapted to set controlvalues into respective first and second shift register means, said firstand second shift register means being used to control the variableresistor means. An arbitration means may then be provided forselectively connecting the first and second control functions to thefirst and second shift register means. By using the arbitration means,an operation of both control functions at the same time can beprevented. As an alternative decoder means may be used to control thevariable resistor means in response to the control values.

Furthermore, a look-up table may be provided for storing a desired valuefor the first control function. By storing value pairs of the operatingfrequency and a voltage code word in the look-up table, the firstcontrol function can be set in accordance with a desired performance.

The local control means may be arranged to control the conductivity byperforming at least one of changing the voltage level of the controlsignal, and switching the control signal. Thereby, different individualdegrees of conduction can be achieved based on the type of changeoperation. Moreover, the control signal may be used to dynamicallychange an element size of the variable resistor means.

The adjusted power supply may be forwarded to a clock generating meansto individually adjust a clock supplied to the at least one electricallyisolated circuit regions. In addition to the at least one electricallyisolated circuit region the circuit may have one or more uncontrolledcircuit region, e.g. a circuit region for the CGU. The clock generatingmeans can thus be placed in the autonomous island whose power supply iscontrolled by the local control means.

Additionally, the local control means may be arranged to control aback-bias voltage of transistor elements provided in the at least twoisolated circuit regions. Thereby, performance of the isolated circuitregions can be individually controlled by properly biasing the bulkterminal of the transistors to change their threshold voltage.

Furthermore, the local control means may be arranged to control a bypassmeans to skip at least one register means of a processing pipeline ofthe at least two isolated circuit regions. Thus, another or additionalmethod of controlling the performance of the isolated circuit regionscan be provided to achieve an efficient configuration.

Furthermore, shift register means may be provided which can be connectedto the variable resistor means and to a clock generator means forsupplying an adjusted clock signal to the isolated circuit regions,wherein the shift register means may be controlled based on a binarycontrol signal supplied from the local control means, and wherein thebinary control signal defines at least one binary value shifted into theshift register means so as to either increase or decrease theperformance of the isolated circuit region. This solution provides theadvantage that performance of the isolated circuit regions can be easilycontrolled based on at last one simple binary control scheme or signal.In particular, the bit values of the shift register means may be used toindividually bypass delay sections of the clock generator means. Thefrequency of the clock generator means can thus be directly controlledbased on the bit values shifted into the shift register means.

As another option, the local control means may be arranged to select apredetermined profile mode from a plurality of profile modes, eachprofile mode defining a predetermined relationship between a set ofperformance parameters of the isolated circuit region. Thus, theselected profile mode ensures that physical variables or performanceparameters are modified continuously so as to meet the specifiedperformance. In particular, specific ones of the parameters can be tiedto other parameters, to thereby provide a coupling between individualparameters. In particular, the performance parameters may comprise aclock frequency, a power supply voltage and a threshold voltage. Thepredetermined profile mode and the performance parameters may be storedin a look-up table. Furthermore, the plurality of profile modes maycomprise a profile mode in which the power supply voltage and the clockfrequency are maintained at a fixed relationship.

Further advantageous modifications are defined in the dependent claims.

In the following, the present invention will be described on the basisof preferred embodiments with reference to the accompanying drawings inwhich:

FIG. 1 shows a schematic block diagram of an island with variableresistor means and control circuitry according to the preferredembodiments;

FIG. 2 shows an example of a multi-core chip design in which thepreferred embodiment scan be implemented;

FIG. 3 shows a schematic circuit diagram of segmented series transistorsaccording to a first preferred embodiment;

FIG. 4 shows a schematic block diagram of a local control circuitaccording to the first preferred embodiment;

FIG. 5 shows a signaling diagram indicating examples of waveforms ofsignals relating to a control loop according to the first preferredembodiment;

FIG. 6 shows a schematic block diagram indicating a variable-depthpipeline configuration according to a second preferred embodiment;

FIG. 7 shows a schematic block diagram of a control module forsimultaneously controlling clock and power supply according to a thirdpreferred embodiment;

FIG. 8 shows a schematic circuit diagram of a linearly programmableclock generator according to the third preferred embodiment;

FIG. 9 shows a schematic circuit diagram of a controllable parallelvariable resistor according to the third preferred embodiment;

FIG. 10 shows a signaling diagram indicating an example of a clockwaveform used in the third preferred embodiment;

FIG. 11 shows a signaling diagram indicating an example of a supplyvoltage in the third preferred embodiment;

FIG. 12 shows a schematic flow diagram of the control function accordingto the third preferred embodiment;

FIG. 13 shows a schematic block diagram of a AIoP shell interfaceaccording to a fourth preferred embodiment; and

FIG. 14 shows a schematic diagram indicating a clock vs supply voltagepairing according to the fourth preferred embodiment.

The preferred embodiments will now be described on the basis of an ICwhich is partitioned into different islands. Each island can becontained in an isolated third well of a triple well CMOS (ComplementaryMetal Oxide Semiconductor) technology. Triple well CMOS technologyallows a well of a first type, e.g. a P-well, to be placed inside a wellof a second type, e.g. an N-well, resulting in three kinds of wellstructures: simple wells of the first type, simple wells of the secondtype, and wells of a third type, consisting of a well of the first typeinside a deep well of the second type. The third type of well is usefulfor isolating circuitry within it from other sections on the chip by areverse bias between the deep well of the second type and the substrate.Each well can be controlled and its working conditions can be modifieddepending on some parameters. The remainder of the chip can becontrolled as well, depending on other parameters. Each island isoperating at one or more utility values, and at least one utility valueof a first island can be different from a corresponding utility value ofa second island.

FIG. 1 shows a schematic circuit diagram of a control scheme accordingto the preferred embodiments, where an CMOS circuit 10 provided on anisland is connected via resistor circuits or resistor means to powersupply voltage terminals, i.e. a reference voltage terminal, e.g. groundterminal GND or terminal V_(SS), and a supply voltage terminal V_(DD).The integrated circuit may be provided with a monitoring function orunit 15 for monitoring at least one working parameter related to aworking condition of the integrated circuit, and at least one island ofthe IC are provided with a local control device 20 for independentlytuning or controlling at least one utility value for at least oneisland, based on the monitored at least one working parameter.

The one or more utility values may comprise one or more of supply power,transistor threshold voltage, transistor back-bias or clock frequency.The transistor threshold voltage may be determined by a bulk voltage ofsome transistors in a computational island, e.g. the transistors of theprocessing core or module. The at least one working parameter related toa global working condition of the integrated circuit may comprise atleast one of circuit activity, circuit delay, power supply noise, logicnoise margin values, threshold voltage value or clock frequency value. Apre-set level of performance may relate to any or all of powerconsumption or speed of the integrated circuit.

According to the preferred embodiments, the variable resistor means actas an actuator provided to control the power supply voltage of the CMOScircuit 10 provided on the island. The control supply voltage can varyin a wide range between ˜Vth and V_(DD) Volts as a function of thedifferent performance parameters like workload or required circuitperformance. The proposed supply voltage actuator offers many advantageswhen it is used in SoC applications, such as adaptive control of theactive power and energy consumption, adaptive control of leakagecurrent, low area overhead when compared to DC-DC converters, simpledigital control, and fast transient response. Furthermore, no additionalexternal components, such as inductivities L or capacities C, arerequired as in case of DC-DC converters.

The supply voltage actuator may be implemented as the above variableresistor which is controlled by the local control device or unit 20,which is explained later in more detail. The variable resistor may beimplemented based on any semiconductor circuit or other circuit having acontrollable resistor functionality or acting as a controllableresistance.

According to the first preferred embodiment, the actuator is implementedas a PMOS transistor M2 and an NMOS transistor M1, which are connectedin series with the CMOS circuit 10 of the island. These transistors M1and M2 add additional resistance between the CMOS circuit 10 and itssupply lines. For example, a low resistance value is required tominimize the voltage drop when the circuit requires its maximumoperating speed. The power supply voltage of the CMOS circuit 10, i.e.V_(DD)−ΔV, can be controlled by changing the series resistance valueintroduced by the transistors M1 and M2. In this way, no changes have tobe made to the global network in case the chip or IC consists ofmultiple islands.

FIG. 2 shows a schematic circuit diagram in which a header transistor M2and a footer transistor M1 are used. The state of the header transistorM2 is controlled by a control signal nCTL, while the state of the footertransistor M1 is controlled by a control signal CTL. The signal CTL isan inversion of the signal nCTL, wherein the voltage V_(nCTL) of thesignal CTL can be obtained from the voltage V_(CTL) of the signal nCTLbased on the equation V_(nCTL)=V_(DD)−V_(CTL). In this case, the CMOScircuit 10 can be put in a standby mode when both the header transistorM2 and the footer transistor M1 are switched off (V_(nCTL)=V_(DD) andV_(CTL)=0), so that the circuit's power consumption is reduced to aminimum value. In the active mode, of the CMOS circuit 10 both seriestransistors are conducting. Different degrees of conduction can beachieved by at least one of changing the voltage levels of the controlsignals nCTL and CTL, applying a switching nCTL and CTL signal, andsizing the geometry of the series transistors M1 and M2 dynamically.These control functions are initiated by the local control unit 20.

As can be gathered from FIG. 2, the integrated circuit is arranged as amulti-core chip design comprising four cores C0 to C3 to which powersupply voltages V_(SS) and V_(DD) are applied via respective wiringsystems. A capacitor C in FIG. 2 represents the internal capacitance ofthe non-switching parts of the circuit and the internal decouplingcapacitance. Since the capacitor C supplies current peaks to the circuit10, the current flowing through both series transistors M1 and M2 mainlycorresponds to the average current consumed by the circuit 10, and thevoltage drop ΔV at both series transistors M1 and M2 will remainapproximately constant.

The isolation of the different island voltage supplies thus can beachieved by the supply voltage actuator consisting of the twotransistors M1 and M2 in the first preferred embodiment. The concept ofvoltage islands can easily be merged with aglobally-asynchronous-locally-synchronous (GALS) solution, in whichindividual islands are operated in a synchronous manner, while theoverall integrated circuit is operated in an asynchronous manner. Theindependent clock of an island can be adjusted by the supply voltageactuator as a function of different parameters such as workload orcircuit performance, i.e., the clock unit can be bound to the powersupply of the island. However, it should be verified that the clockfrequency fits to the island's speed by properly adjusting the powersupply. This action, which could take place simultaneously for variousislands, can easily be accomplished with the proposed supply voltageactuator.

FIG. 3 shows a specific example of the supply voltage actuator accordingto the first preferred embodiment, where the series transistors M1 andM2 are divided into N segments. Each transistor segment or a subset ofsegments can be controlled by a bit from respective dedicated controlregisters 202, 204. Thereby, a discrete control of the resistance valuecan be introduced by the segmented series transistors M1 and M2.

According to FIG. 3, a segment is conducting when the correspondingcontrol bit of the respective control register is at high level, and asegment is not conducting when the control bit is at low level in caseof the N-MOS footer transistor. On the other hand, in case of the PMOSheader transistor, a segment is conducting when the correspondingcontrol bit is at low level, while the segment is not conducting whenthe control bit is at high level. The control registers 202 and 204 canbe easily programmed or reprogrammed at runtime, thus enabling adaptivesupply voltage control. The number of segments, their geometry and thesize of the control registers 202, 204 determine the resolution or stepsize and the range of supply voltage control. Furthermore, the size ofthe non-switching circuit capacitance C needs to be well-sized in orderto cope with the voltage fluctuations of ΔV at the header and footertransistor segments.

It is obvious that the same control function shown in FIG. 3alternatively can be implemented by a single control register with itsoutput connected to one segmented transistor and the inverted outputconnected to the other segmented transistor.

The control values set into the control registers 202, 204 are suppliedby the local control unit 20. This kind of online correction may consistof two control functions, namely a μ-control which compensates foraverage voltage fluctuations and a track-control which acts on localvoltage changes. The μ-control compensates cold-start offsets due toprocess variability or other environmental or chip-specific influences.For instance, if the island is in a fast process corner then it ispossible that a slightly lower supply voltage may be sufficient to reachits target operating frequency. This power supply offset compensationcan be based on actual on-chip silicon measurements. Due to thevariability of the fabrication process, every chip in a wafer isdifferent from the others. Typically, a wafer is divided into variousregions yielding slow, nominal and fast transistors. Conventional designmethodologies make use of worst-case conditions, i.e. slow transistors,to carry out the design.

The μ-control is periodically performed to take into account operationaldrifts due to, for instance, temperature gradients. On the other hand,the track-control compensates voltage fluctuations due to activitychanges as a result of more or less processing operations of inputstream data in the CMOS circuit 10. The mean value is adjusted overlonger periods of time while the standard deviation can be done on acycle-to-cycle basis.

FIG. 4 shows a block diagram of an online correction stage as providedin the local control unit 20. This circuit requires prior knowledge ofthe absolute clock frequency, the number of counts N_(f,i) to begenerated by a clock generating unit CGU for each frequency value, aswell as the number of ones or zeros N_(VDD,i) required to setup aμ-shift register μ-SR used for controlling the conductance of a variableresistor. These preset values can be stored at the design stage of theintegrated circuit. In fact, the number of counts N_(f,i) is a digitalrepresentation of the operating frequency of the circuit. Each value ofN_(f,i) is tied to a unique N_(VDD,i) value, which results in a set of(N_(f,i), N_(VDD,i)) pairs which may be stored in a correspondinglook-up table LUT.

The clock generating unit CGU is placed in an autonomous island whosepower supply is controlled by the μ-shift register μ-SR and an O-shiftregister O-SR. Furthermore, the controlled CMOS circuit 10 can be placedin a different autonomous island whose power supply is controlled by theμ-shift register μ-SR, the O-shift register O-SR and a track shiftregister t-SR. Thereby, it is prevented that the power supply of theclock generating unit CGU is influenced by the σ-control function.

The adaptive control procedure of the power supply can be performed asfollows. The user or, e.g. a power-management unit (not shown) providesthe performance requirement by means of selecting the desired frequencyrepresented by the number of counts N_(f,i). The μ-shift register μ-SRis loaded with the N_(VDD,i) which is necessary to have the clockgenerating unit CGU operated at the desired frequency f_(i). The clockgenerator may comprise any suitable clock generating circuit, e.g. basedon a phase-locked loop (PLL) or any other oscillator circuit. Aμ-counter μ-CT is adapted to count the number of pulses generated by theclock generating unit CGU during a predetermined time period, andthereby translating its oscillation frequency into a digitalrepresentation. After the count period as elapsed, the content N_(C) ofthe μ-counter μ-CT is loaded into a register R and compared to thedesired number of counts N_(f,i) in a μ-comparator μ-C. If it isdetermined at the μ-comparator μ-C that N_(f,i) is larger than N_(C),this means that the silicon of the circuit is slower and as such thepower supply voltage must be increased to equalize the counts. On theother hand, if it is detected that N_(f,i) is smaller than N_(C), thepower supply voltage must be decreased to equalize the counts. This isdone by changing the content of the O-shift register O-SR.

A reset signal is supplied to the μ-counter μ-CT by the μ-comparator μ-Cafter every comparison. The clock generating unit CGU is enabled at thepositive edge of an absolute clock reference ACLK supplied thereto. Thisclock reference ACLK can be much slower than the maximum frequency ofthe circuit under control resulting in a binary μ-counter μ-CT andholding μ-register R of 10 bits, for example.

Additionally, to compensate for changes due to local activity of theCMOS circuit 10, a second and faster control function is provided. Thissecond control function is called track-control or track-loop. Thetrack-control operates as follows. The output of the clock generatingunit CGU is compared with its delayed version obtained from a delay lineor delay unit DL in a phase-frequency-detector (PFD) unit t-CM. Thedelay unit DL can be a replica of the critical path of the CMOS circuit10 with a possible safety margin delay. The delay unit DL is embedded inthe CMOS circuit 10 to be controlled. If the PFD unit or trackcomparator t-CM detects that the original signal supplied from the clockgenerating unit CGU are not in synchronization, then the track shiftregister t-SR is adjusted by changing its contents. If the delayedsignal has a delay lower than one clock cycle, the power supply voltagemust be reduced. On the other hand, if the delayed signal has a delayhigher than one clock period, the power supply voltage must beincreased. The desired power supply voltage is found if the original anddelayed signals are synchronized.

Furthermore, an arbitration unit ARB is provided to prevent both loopsfrom operating at the same time. In particular, the arbitration unit ARBperforms control to select which of the two control functions, i.e. theslow control function or the fast control function, updates its shiftregister when both control functions intend to update their shiftregister at the same time. Thereby, conflicts between the controlsignals can be prevented by giving one control function a higherpriority, e.g., the μ-control.

Due to the fact that the clock generating unit CGU is provided on adifferent island, it is not affected by the activity fluctuations of thecontrolled CMOS circuit 10. However, both the clock generating unit CGUand the controlled CMOS circuit 10 share the same control signals forthe μ-shift register μ-SR and the O-shift registers O-SR, while theadditional control signals of the track shift register t-SR are suppliedto the controlled CMOS circuit 10 only. Consequently, both havedifferent transistor segments between their controlled power supply andthe common power supply, which means that their controlled powersupplies are not shared. The control shift registers 202, 204 of FIG. 3can thus be basically divided into several sections, e.g. three sectionswhich correspond to the μ-shift register μ-SR, the O-shift register O-SRand the track shift register t-SR. The μ-shift register μ-SR and theO-shift register O-SR relate to the μ-control function, while the trackshift register t-SR relates to the track-control function.

The digital code word of the μ-shift register μ-SR is set by the desiredperformance, i.e. N_(VDD,i). The update of the μ-shift register μ-SR isdone using an open-loop approach, i.e. no feedback control. However,operational drifts, temperature or process variations cause problemswhen working in an open-loop control only. Therefore, the O-shiftregister O-SR is additionally used to compensate for these operationaldrifts. The corresponding slow loop of the μ-control function builds afeedback control system to adapt the conductivity of the seriestransistors to these variations and/or drifts. Furthermore, in case ofany activity fluctuations which happen on a cycle basis, the track shiftregister t-SR tracks the activity fluctuations and corrects properlyusing a feedback control.

In view of the fact that the control shift registers 202, 204 consist ofa finite number of elements, they can control the resistance of theseries transistors M1, M2 only within a certain range. If a resistanceis required beyond this range, an error flag can be enabled. This can beinterpreted as an overflow or underflow of the control shift registers202, 204.

In summary, the clock generating unit CGU is tied to its own controlledV_(DDC), while the controlled CMOS circuit 10 is controlled by allcontrol functions and receives a clock frequency generated by the clockgenerating unit CGU.

FIG. 5 shows signaling diagrams with waveforms relating to thetrack-control function, wherein the signals from the top to the bottomrelate to the controlled power supply voltage V_(DD), the (reference)clock frequency REFCK of the clock generating unit CGU, the delayedclock version DELCK, a control signal DN indicating if the power supplyvoltage should be reduced, a least significant bit value F0 of thebinary control word for the footer transistor M1, a most significant bitvalue F31 of the binary control word of the footer transistor M1, acontrol signal JUST indicating if the power supply voltage should bekept constant, and a control signal UP indicating if the power supplyvoltage should be increased. The initial value of the controlled powersupply voltage V_(DD) can be set by the μ-control function based on theinformation obtained from the look-up table LUT. Then, the track-controlfunction adjust the power supply voltage to the desired value asindicated by the arrow A. The control signal JUST is set to ‘1’ over thepower supply voltage V_(DD) reaches its desired value. As can begathered from FIG. 5, the LSB F0 is continuously set to high level ‘1’,while the MSP is continuously set to low level ‘0’.

In the following, a second preferred embodiment is described, where thelocal control unit 20 is adapted to change the pipeline depth of atleast one processing function provided in the controlled CMOS circuit10.

Modern processors use pipelines to serialize and optimize theinstruction execution to improve their performance. However, it is wellknown, that the optimal pipeline depth depends on a running applicationor even its current section. Therefore, it is proposed to allow thelocal control unit 20 to modify the pipeline depth of a processing stageor function of the controlled CMOS circuit 10 by means of merging orskipping some pipeline stages, which will also result in the necessityto alter the operating or clock frequency. Hence, the pipeline depth canbe chosen individually for each island to optimize performance, e.g.multimedia applications require a maximum pipeline depth, whilereal-time applications might use an intermediate pipeline depth, etc.Any pipeline would benefit from this approach, while, however a balancedpipeline where the logic between two register banks have similar delayswould benefit the most.

FIG. 6 shows a variable-depth pipeline according to the second preferredembodiment where two operations A and B are performed in respectiveprocessing or logical units. If an intermediate register R_(A) can beskipped, the operations A, B can be executed in one clock cycle and thepipeline depth could be effectively changed to 2. To achieve this, anextra logic PD (Pipeline Disable) is added, which allows to gate theclock of the intermediate register R_(A). Furthermore, a bypass unit BP,which may be a multiplexer or other selective switching circuit, isadded to select the appropriate input to the logic or operation B. Byadding these structures to every register barrier, the pipeline depthcan be altered completely.

There can be many ways by which an application or the local control unit20 could try and change the pipeline depth. One way is to specify apipeline profile which defines which register barrier should be skippedand the necessary operating frequency to be set by the above μ-controlfunction. The enabling and disabling of the pipeline stage may as wellbe based on corresponding instructions of a software routine.

In example shown in FIG. 6, the pipeline comprises the operation Afollowed by the register R_(A) and the operation B followed by aregister R_(B). While the operation A computes the output value O_(A)based on the input value I_(A), the operation B computes the outputvalue O_(B) based on the input value I_(B). The input value I_(B) is theoutcome of the operation A in the previous clock cycle.

A disadvantage of the pipelined operation is that latency increases. Theclock period T supplied to the pipeline has to be adapted to the longestdelay time occurring in the chain. Thus, the latency with which theoutput value O_(B) is available can be expressed as T+τ_(B), which isusually longer than τ_(A)+τ_(B), wherein τ_(A) and τ_(B) are thelatencies for the operations A and B, respectively.

In the second preferred embodiment, the local control unit 20 controlsthe bypass unit B to enable the skipping of one or more registers in thepipeline. Skipping a register can be advantageous if the operations inthe pipeline only have to be performed incidentally. The control can beperformed by setting a control value into a control latch or flipflopC₀, while the input value I_(A) is supplied to an input register R₀.Thus, the latency can be shortened which has a relevant effect on thethroughput of the pipeline. This throughput corresponds to the number ofinstructions which can be carried out in a certain time period. Whileskipping one or more register stages, the latency is reduced but thethroughput is lowered, because a waiting time must be introduced until anew input value can be processed in both stages.

Next, a modified supply voltage actuator for combined control of clockfrequency and supply voltage is described in connection with the thirdpreferred embodiment. In particular, a modified actuator tuning functionenables easy control of the performance of the controlled circuit 10 ofFIG. 1.

When the performance demand is low, the power supply can be lowered,delivering reduced performance but with a substantial power reduction.For high performance demands, the highest supply voltage delivers thehighest performance at the fastest designed frequency of operation.Furthermore, such an approach can be used for tracking process andtemperature variations. All schemes which have so far implemented thisapproach are based on receiving one or more performance indicators,which normally correspond to the desired clock frequency and supplyvoltage provided to the controlled system. The intelligence behind themanipulation of electrical parameters like power supply and operatingfrequency are thus arranged externally from the controlled circuit 10.

The basic idea of the actuator according to the third preferredembodiment is to replace the philosophy of given performance indicationby simply requesting for more or less performance. This can beaccomplished with a binary signal, i.e. at most two bit values, andleads to a very simplified implementation based on a shift register orfirst-in-first-out (FIFO) memory, a variable resistor used to generatethe controlled supply voltage for the controlled circuit 10, and alinearly programmable clock generator.

FIG. 7 shows a generic implementation of this control scheme. Binarycontrol signals UP and DN are provided by the local control unit 20 andindicate whether more or less performance is required. Both signalscontrol the FIFO or shift register 31 and are used as push or popsignals. Alternatively, a single binary control signal could be used,which is supplied and split into a non-inverted and inverted version toobtain the UP and DN values.

The bits stored in the shift register 31 are sent to a variable resistor32 and to a clock generator 30. In response thereto, the clock generator30 generates a regulated clock RCLK, and the variable resistor 32generates a regulated supply voltage RSP.

FIG. 8 shows a schematic circuit diagram of an example of the clockgenerator 30. According to FIG. 8, the clock generator 30 consists of aloop comprising an inverter and a plurality of delay sections D1 to D3which can be bypassed based on control signals C₀, C₂, . . . , C_(2n),derived from the respective even bit positions of the shift register 31.Due to the fact that the total delay of the loop of the clock generator30 determines the regulated clock frequency RCLK, the clock frequencycan be controlled based on the bit values stored in the shift register31.

FIG. 9 shows a schematic circuit diagram of an example of the variableresistor 32 connected between a regulated supply terminal RSP and anunregulated supply terminal URSP. The variable resistor 32 comprises aplurality of parallel resistor branches which can be individuallyswitched based on control signals /C₁, /C₃, . . . , /C_(2n+1) obtainedfrom an inversion or negation of the respective odd bit positions of theshift register 31. Of course, the controllable resistor circuit of FIG.9 can be replaced by the transistor segments shown in FIG. 3, whereinthe control signals are supplied to the control terminals of thetransistor segments.

While increasing the number of logical ‘1’ values in the pattern, thetotal delay of the clock generator 30 is increased (as the number ofactive delay sections is reduced in FIG. 8) and the total resistance ofthe variable resistor 32 is reduced (as the number of open resistorbranches in FIG. 9 increases).

The control scheme works as follows:

Initially, the shift register 31 will have a logical ‘1’ at its firstbit position or slot and the remaining bit positions or slots are filledwith logical ‘0’, which results in a pattern ‘100 . . . 000’. Thisensures that the variable resistor is at its minimum value (all resistorbranches are connected or closed) and the clock generator provides thefastest clock corresponding to the lowest total delay (only one delaysection D1 is active), which is however an arbitrary choice. When thelocal control unit 20 enables the control signal DN, the number of slotscontaining logical ‘1’ is increased by shifting a logical ‘1’ into theshift register 31 (shift to the right in FIG. 7) to obtain a pattern‘110 . . . 000’. Depending on the new slot which is set by the shiftoperation, i.e. odd or even slot, either the supply voltage or the clockfrequency is reduced. On the other hand, when the local control unit 20enables the control signal UP, the number of slots containing ‘1’ isdecreased by removing a logical ‘1’ from the shift register 31 (shift tothe left in FIG. 7) to obtain the pattern ‘100 . . . 000’. Depending onwhich slot is reset, i.e. odd or even slot, either the supply voltage orthe clock frequency is reduced.

The sequence of actions is such that the clock frequency is reducedalways before the supply voltage and the supply voltage is alwaysincreased before the clock frequency. In the proposed control scheme,rising (and of course releasing) the control signals UP and DN causesonly one change in the state of the shift register 31. It could be alsopossible to feed the shift register 31 with the generated clock RCLK, asindicated by the dotted line in FIG. 7, so that a plurality of slots areset or reset as long as the control signal UP or DN is kept high.

The controlled circuit 10 operates at its maximum performance when theshift register 31 is filled only with logical ‘0’, while largest powersavings are obtained in case the shift register 31 is filled only withlogical ‘1’. Since the local control unit 20 controls the clockgenerator 30, it knows a clock frequency or operating frequency for agiven data word of the shift register 31. On the other hand, aperformance monitor, e.g. a ring oscillator and a counter, can be usedto perform real-time measurements of the performance of the controlledcircuit 10.

FIG. 10 shows signal diagrams indicating, from the top to the bottom,waveforms of the regulated clock signal RCLK, the control signal UP andthe control signal DN. As can be gathered from FIG. 10, the regulatedclock signal RCLK increases in frequency when the control signal UP ison a high logical state, while the regulated clock signal RCLK decreasesin frequency, when the control signal DN is in a high logical state.

FIG. 11 shows a signal diagram indicating a waveform of the regulatedsupply voltage RSP or V_(DD) over time, where a stepwise voltagedecrease based on a corresponding change of the content of the shiftregister 31 can be observed.

FIG. 12 shows a schematic flow diagram indicating processing steps of aproposed control scheme according to the third preferred embodiment,wherein the left portion of FIG. 12 corresponds to a software portion SWof the control scheme and the right portion of FIG. 12 corresponds to ahardware portion HW of the control scheme.

In step 10, the application is normally compiled by a standard compiler.Then in step 11, a standard profiler is used to extract a statisticalprofile of the application which gives information on the behavior ofthe application and its performance requirements. Based on the statisticprofile obtained in step 11, the performance indicators can be extractedin step 12. Thus, step 12 depends on the hardware that is going to beused. For the proposed solution, this assumption is not necessary and anindicator could only express the performance requirement of a section ofthe application in comparison with one of the other sections.

In step 13, the indicators or control values UP and DN are extracted inrespective partial steps 13 a and 13 b. This extraction can be doneindependently from the hardware or tuned to the hardware, e.g. tuned toa specific initial guaranteed performance on which the control signalsUP and DN are referenced to. In step 14, the control values UP and DNare embedded in the application as a two-bit or one-bit field for eachinstruction, for a fixed or variable application section or as aseparate program. As already mentioned above, the UP and DN controlvalues may as well be derived from a single binary control value or bit,wherein a first state of the single control bit relates to a high valueof the control signal UP and a second state of the control bit relatesto a high value of the control signal DN. In step 20 of the hardwaresection HW, the control values UP and DN are extracted from theapplication. This extraction depends on step 14. Then, in step 21 theapplication is executed and the hardware is tuned depending on thecontrol values UP and DN in respective partial steps 21 a and 21 b.

Next, a fourth preferred embodiment is described, which relates to acontrol scheme for controlling supply voltage, clock frequency andbody-bias of the CMOS circuit 10 of FIG. 1. In particular, the fourthpreferred embodiment relates to a very simple autonomous scheme where aperformance indicator is supplied and the three physical variables clockfrequency, voltage supply and body-bias are modified accordingly andcontinuously so as to meet the specified performance. One advantage ofthis fourth preferred embodiment is that the clock frequency is tied tothe supply voltage. In other words, scaling the supply voltage V_(DD) upand down results in a corresponding change of the clock frequency. Thisaspect is important in autonomous islands of performance (AIoP) due tothe fact that the speed of the circuit and clock are made to match aproper scaling of the power supply.

From a system standpoint, the AIoP approach aims at developing keycircuit design technologies for future IP platforms and assumes that theSoC is composed of islands. Essentially, the AIoP technology providesthe hardware infrastructure, referred to as AIoP shell, to adapt theperformance of an island or clusters of islands, such that a certainlevel of performance is guaranteed in terms of both speed and power. TheAIoP technology selects the islands optimum power supply and thresholdvoltage for a given desired performance in terms of speed and/or powerconsumption.

FIG. 13 shows a schematic block diagram of an AIoP shell which inputconsists of a profile mode and the islands target frequency. The profilemode is an indication for the islands level of activity. Two mainprofile modes can be distinguished namely an active mode and a standbymode. As set out in a subsequent section each of these main profilemodes can be subdivided in subprofiles. A calibration phase is alsopossible. The shell acknowledges all of the profile, frequency andcalibration requests. The frequency (defined by a frequency pointer FP),i.e. the frequency of the clock generated by the clock generating region41, profile mode (defined by a profile pointer PP) and power supplyvalues V_(DD) are kept in a look-up table (LUT) 50. AIoP controllers48-1 and 48-2 and a calibration unit 49 make use of the LUT 50 fordynamic tuning of the island under control. Since islands can havedistinct power supply voltages, level shifters 42 are needed tocommunicate with other islands.

The calibration unit 49 is controlled by a calibration start (CS) signaland generates a calibration ready (CR) signal when the calibration hasbeen finished. A threshold controller 48-1 generates a profile ready(PR) signal when the desired profile has been set. The supply controller48-2 generates a frequency ready (FR) signal when the circuit operatesat the desired operating frequency, and a frequency error (FE) signal incase the desired frequency cannot be reached. Furthermore, the AIoPshell which is provided on the island 40 includes a threshold monitoringunit 43 for monitoring the voltage threshold of the controlled circuit,a speed monitoring unit 47 for monitoring the circuit speed, and a PSNmonitoring unit 46 for monitoring the power supply noise of thecontrolled circuit.

Furthermore, the island 40 which may be provided in an isolated thirdwell of a triple well CMOS technology comprises an N-well region 44 anda P-well region 45 in which processing elements of the controlledcircuit 10 are arranged, and a clock generating region or functionality41. These regions are monitored by the threshold monitor 43, the PSNmonitor 46 and the speed monitor 47.

The AIoP shell of FIG. 13 offers the possibility of setting the AIoPisland 40 in different profile modes. Generally, two profile modes canbe distinguished, namely an active mode and a standby mode. In theactive mode, the following sub-profiles can be selected:

-   -   A high performance profile, in which the threshold voltages are        brought to a minimum value and the power supply is paired or        fixedly related to the required clock frequency.    -   A typical performance profile, in which threshold voltages are        kept at their typical values and the power supply is paired of        fixedly related to the required frequency.    -   A low power performance profile, in which the threshold voltages        are brought to the maximum value and the power supply is paired        or fixedly related to the required clock frequency.

On the other hand, in the standby mode, the following sub-profiles canbe selected:

-   -   A cool profile, in which a clock gating is applied, and the        power supply is lowered to its minimum allowable value while the        threshold voltages are risen to their maximum allowable voltage.        This mode or profile can be used for low power purposes.    -   A cold profile, in which the same settings as in the cool        profile are used, but the power supply is cut off from the        combinational logic while retaining the circuit state of the        flipflops, latches or the like. This mode or profile is suitable        for low power low leakage needs.    -   A cryogenic profile, in which the entire island 40 is simply        turned off.

The tuning scheme of the AIoP shell matches power-supply-voltage andclock pairs to a given profile mode which depends on a selection of thethreshold voltage. Thus, a change in the power supply voltage isreflected by a change in the clock's frequency and circuit speed. Animmediate consequence of this approach is that the frequency spectrum,for the island under consideration, bounds the supply voltage range toupper and lower limits. Due to the fact that power supply and clock arepaired, the size of the power supply step determines also the frequencystep of the clock.

FIG. 14 shows a frequency versus voltage diagram indicating a clock andsupply voltage pairing used in obtaining programmable clock frequenciesaccording to the fourth preferred embodiment.

The AIoP technology is using a programmable clock that can operate insuch a way that frequency can be safely changed discretely, i.e. fromany value to any other value, with predictable latency of one clock.This frequency step is referred to as major step Δfmj. In FIG. 14, thetwo arrows indicate a tuning relationship between a change of the supplyvoltage from a minimum supply voltage V_(DD,min) to a nominal supplyvoltage V_(DD,nom) and the corresponding major step Δ_(fmj). Once theclock is programmed, minor frequency steps Δ_(fmn) are obtained byscaling the power supply of the controlled circuit 10, as indicated bythe dotted lines, and the clock can be made to match by a proper scalingof the power supply.

It is to be pointed out that the specific features of the abovepreferred embodiments can be combined or exchanged without departingfrom the scope of the present invention. E.g. the specific actuatoraccording to the third preferred embodiment may be applied in the firstembodiment, and the control schemes of the first and second embodimentmay be applied in the fourth preferred embodiments. Any kind ofswitching arrangement can be used for switching the transistor orresistor elements which form the variable resistors shown in FIG. 1.Moreover, the number of shift registers used in the control scheme ofFIG. 4 may vary as long as the two control functions can be combined.The variable-depth control of the pipeline in FIG. 6 can be obtained byother switching and/or control arrangements suitable for bypassing atleast one of the registers.

It is further noted that the present invention is not limited to theabove preferred embodiments and can be varied within the scope of theattached claims. In particular, the described drawing figures are onlyschematic and are not limiting. In the drawings, the size of some of theelements may be exaggerated and not drawn on scale for illustrativepurposes. Where the term ‘comprising’ is used in the present descriptionand claims, it does not exclude other elements or steps. Where anindefinite or definite article is used when referring to a singularnoun, e.g. ‘a’ or ‘an’, ‘the’, this includes a plural of that noununless something else is specifically stated. The terms first, second,third and the like in the description and in the claims are used fordistinguishing between similar elements and not necessarily fordescribing a sequential or chronological order. It is to be understoodthat the embodiments of the invention described herein are capable ofoperation in other sequences than described or illustrated herein.Moreover, although preferred embodiments, specific constructions andconfigurations have been discussed herein, various changes ormodifications in form and detail may be made without departing from thescope of the attached claims.

The invention claimed is:
 1. A circuit arrangement for controlling powersupply in an integrated circuit partitioned into different islands, thecircuit arrangement comprising: a) a variable resistor device configuredto individually adjust a power supply of a plurality of electricallyisolated circuits provided on the islands; and b) a monitoring deviceconfigured to monitor at least one working parameter of the plurality ofthe electrically isolated circuit; c) a local control device configuredto independently control the power supply for each of the plurality ofelectrically isolated circuits based on the at least one monitoredworking parameter of the plurality of electrically isolated circuits; d)wherein the local control device is configured to supply a controlsignal to the variable resistor device so as to control the conductivityof the variable resistor device.
 2. A circuit arrangement according toclaim 1, wherein the variable resistor device comprises at least onetransistor connected in series between the isolated circuits and atleast one power supply terminal.
 3. A circuit arrangement according toclaim 2, wherein the at least one transistor comprise a first transistorconnected between a first power supply input of a dedicated one of theisolated circuits and a first one of the power supply terminals, and asecond transistor connected between a second power supply input of thededicated one of the isolated circuits and a second one of the powersupply terminals, wherein the local control device is configured tosupply a first control signal to the first transistor and a secondcontrol signal to the second transistor, and wherein the first controlsignal is an inversion of the second control signal.
 4. A circuitarrangement according to claim 2, wherein the at least one transistor isdivided into a plurality of transistor segments, each segment or subsetof segments being connected to a bit of a dedicated control registerwhich is set by the local control device.
 5. A circuit arrangementaccording to claim 1, wherein the local control device comprises a firstcontrol function for compensating average voltage fluctuations, and asecond control function for compensating voltage fluctuations due toactivity changes of a dedicated one of the plurality of electricallyisolated circuits.
 6. A circuit arrangement according to claim 5,wherein the first control function is used for controlling a clockfrequency of the dedicated one of the plurality of electrically isolatedcircuits.
 7. A circuit arrangement according to claim 5, wherein thefirst and second control functions are configured to set control valuesinto respective first and second shift registers the first and secondshift registers being used to control the variable resistor device.
 8. Acircuit arrangement according to claim 5, further comprising arbitrationunit for selectively connecting the first and second control functionsto the first and second shift registers.
 9. A circuit arrangementaccording to claim 5, further comprising a look-up table for storing adesired value for the first control function.
 10. A circuit arrangementaccording to claim 1, wherein the local control device is configured tocontrol the conductivity by performing at least one of changing thevoltage level of the control signal and switching the control signal.11. A circuit arrangement according to claim 1, wherein the controlsignal is used to dynamically change an element size of the variableresistor device.
 12. A circuit arrangement according to claim 1, whereinthe adjusted power supply is forwarded to a clock generating unit toindividually adjust a clock supplied to the plurality of electricallyisolated circuits.
 13. A circuit arrangement according to claim 1,wherein the local control device is configured to control a back-biasvoltage of transistor elements provided in the plurality of isolatedcircuits.
 14. A circuit arrangement according to claim 1, wherein thelocal control device is configured to control a bypass unit to skip atleast one register of a processing pipeline of the plurality of isolatedcircuits.
 15. A circuit arrangement according to a claim 1, furthercomprising a shift register connected to the variable resistor deviceand to a clock generator unit configured to supply an adjusted clocksignal to the isolated circuits, wherein the shift register iscontrolled based on a binary control signal supplied from the localcontrol device and wherein the binary control signal defines a binaryvalue shifted into the shift register so as to either increase ordecrease the performance of the isolated circuits.
 16. A circuitarrangement according to claim 15, wherein bit values of the shiftregister are used to individually bypass delay sections of the clockgenerator unit.
 17. A circuit arrangement according to claim 1, whereinthe local control device is configured to select a predetermined profilemode from a plurality of profile modes, each profile mode defining apredetermined relationship between a set of performance parameters ofthe isolated circuits.
 18. A circuit arrangement according to claim 17,wherein the performance parameters comprise a clock frequency, a powersupply voltage and a threshold voltage.
 19. A circuit arrangementaccording to claim 17, wherein the predetermined profile mode and theperformance parameters are stored in a look-up table.
 20. A circuitarrangement according to claim 17, wherein the plurality of profilemodes comprise a profile mode in which the power supply voltage and theclock frequency are maintained at a fixed relationship.
 21. A method ofcontrolling power supply in an integrated circuit partitioned intodifferent islands, the method comprising the steps of: a) monitoring atleast one working parameter of a plurality of electrically isolatedcircuits provided on the islands; and b) locally controllingconductivity of variable resistor device so as to individually adjustpower supply for each of the plurality of electrically isolated circuitsbased on the at least one monitored working parameter.